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Toshiro Doi, Ioan D. Marinescu, Syuhei Kurokawa's Advances in CMP Polishing Technologies PDF

By Toshiro Doi, Ioan D. Marinescu, Syuhei Kurokawa

ISBN-10: 1437778593

ISBN-13: 9781437778595

CMP and sharpening are the main certain procedures used to complete the surfaces of mechanical and digital or semiconductor elements. Advances in CMP/Polishing applied sciences for Manufacture of digital units offers the newest advancements and technological options within the box – making state of the art R&D available to the broader engineering neighborhood.

Most of the purposes of those strategies are saved as private as attainable (proprietary information), and particular info will not be obvious in expert or technical journals and magazines. This booklet makes those tactics and purposes available to a much broader business and educational audience.

Building at the basics of tribology – the technological know-how of friction, put on and lubrication – the authors discover the sensible functions of CMP and sprucing throughout a number of marketplace sectors. as a result excessive speed of improvement of the electronics and semiconductors undefined, a number of the provided methods and purposes come from those industries.

  • Demystifies clinical advancements and technological options, commencing them up for brand new purposes and procedure advancements within the semiconductor and different parts of precision engineering
  • Explores inventory elimination mechanisms in CMP and sharpening, and the demanding situations taken with predicting the results of abrasive techniques in high-precision environments
  • The authors collect the newest concepts and learn from america and Japan

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Sample text

Although a fixed-abrasive wire with diamond grit attached by electroplating has been successfully developed, it has high production costs. In order to reduce these costs, we have recently developed a new technique where the diamond grit is fixed onto the bare wire by resin bonding instead of electroplating. Watanabe et al. 8). They fabricated solar cells using these wafers and studied their electrical characteristics. From these experiments, they showed that wafers sliced with a fixed-abrasive wire with resin-bonded diamond grit have a saw-damage layer that is more than a factor of two thinner than those of wafers sliced with a loose-abrasive wire.

It replaces the loose abrasives with a fixed abrasive lapping plate, and replaces the slurry with a water-based fluid. The mechanism of lapping with bonded abrasives is similar to abrasion by embedding in single-sided lapping. The work piece is pressed against a rotating lapping plate, which is embedded with abrasives. The grains remove material by the mechanism of two-body abrasion. 30. In their general appearance and function the lapping machines that use this principle closely resemble grinding machines.

This generates a large amount of industrial waste, including waste slurry and wires. A fixed-abrasive wire, in which diamond grit is attached to a bare wire, has been developed as an alternative. An advantage of this latter method is that it is possible to slice wafers by supplying a water-soluble coolant (grinding fluid) without the need for any slurry. Moreover, the fixed-abrasive wire saw has a higher slicing speed and the spent grinding fluid can be recycled. Although a fixed-abrasive wire with diamond grit attached by electroplating has been successfully developed, it has high production costs.

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Advances in CMP Polishing Technologies by Toshiro Doi, Ioan D. Marinescu, Syuhei Kurokawa


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